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Lead-Free / RoHS 3 Compliant / REACH Compliant
Description
Solder Paste No-Clean Au80/Sn20 Gold/Tin in 5cc syringe 5g, w/plunger & tip, T5 mesh
Specifications
Alloy: Au80/Sn20
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Content: 89% metal by weight.
Particle Size: T5 (15-25 microns)
Melting Point: 280C (536F)
Size: 5cc/5g syringe
Shelf Life
Refrigerated >6 months, unrefrigerated >2 months
Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
Documents
Datasheet
MSDS Sheet
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