Solder Paste in jar 250g (T4) Sn63/Pb37 no clean 90.25% metal.
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Content: 90.25% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 183C (361F)
Size: 250g jar
Refrigerated >12 months, unrefrigerated >6 months
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
WARNING! This product can expose you to Lead, which is known to the State of California to cause Cancer, Birth Defects, or other Reproductive Harm. For more information, go to: www.P65Warnings.ca.gov