Description:
Pink ESD Foam, Lead Insertion Grade, 12" x 9" x 1/2".
Designed for IC leg and pin insertion. Can also be used for blocking, bracing, cushioning and wrapping sensitive electronic devices.
Crosslinked high-density polyethylene, rigid, closed-cell, anti-static, electrostatic dissipative, surface resistance 1x10^9 to 1x10^12 ohms/square.
Specifications:
Foam Type: Crosslinked high-density polyethylene, rigid, closed-cell, anti-static, electrostatic dissipative.
Surface Resistance: 10^9 to 10^12 ohms/square
Dimension: 12" x 9" (304.8 x 228.6 mm)
Thickness: 0.5" (12.7 mm)
Dimensional Tolerances: -2% / +4%
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Datasheet
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