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Heat Sink Thermal Compound - Deep-Space Liquid Metal 79 W/mK 10g/3cc Syringe

[Part Number: TC4-10G]
In Stock
Click to enlarge

Lead-Free / RoHS 3 Compliant / REACH Compliant
CHIPQUIK® Deep-Space Liquid Metal™ Thermal Compound. Liquid Metal, non-curing, flowable, thermally conductive heat sink compound. Pure Liquid Metal. Provides extremely high thermal conductivity of 79 W/mK, low bleed and high temperature stability. Electrically Conducting. Alloy contains Gallium and is not compatible with Aluminum Heat Sinks.

Alloy: 100% Deep-Space Liquid Metal™ Pure Metal Proprietary Formula
Heat Sink Material Compatibility: Nickel-Plated Copper, Nickel, Copper*
Heat Sink Material Incompatibility: Aluminum (Do Not Use with Aluminum Heat Sinks)
Density: 6.8g/cc
Thermal Conductivity: 79 W/mK
Thermal Resistance: 0.003 C*cm2/W
Operating Temperature (Continuous): -40 to 150C (-40 to 302F)
Operating Temperature (Peak): 200C (392F)
Size: 10g/3cc Manual Syringe w/ 2x 25-gauge tips, squeegee

*Gallium is known to alloy with various other metals. TC4 should be tested in your individual application to ensure long term reliability.

Application Instructions
Apply sparingly with provided tips. Thinly spread using provided squeegee. Deep-Space Liquid Metal™ is highly conductive and is designed to fill all small cracks and crevices in surfaces to achieve extremely high thermal conductivity. Deep-Space Liquid Metal™ is thermally and electrically conductive, avoid getting it on electrical pins/pads/traces/BGA balls.

Storage and Handling
Store at room temperature 20-25C (68-77F).

Shelf Life
>60 months

This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.


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