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What's New? more
SMT to SOIC-Wide Header (1.27mm Pitch, 22 Pin, for 300 mil IC body) (SOIC22W/SOIC-22W)
SMT to SOIC-Wide Header (1.27mm Pitch, 22 Pin, for 300 mil IC body) (SOIC22W/SOIC-22W)
$5.20
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Heat Sink Thermal Compound / Grease - Grey Ultra Max Conductive 1g Syringe 1cc

[Part Number: TC3-1G]
$5.95
USD
In Stock
Quantity:
100
Click to enlarge

Lead-Free / RoHS 3 Compliant / REACH Compliant
Description
CHIPQUIK® Ultra Max™ High Density Thermal Paste. Grey, non-curing, flowable, thermally conductive heat sink compound. Heavily filled with heat-conductive metal oxide. Provides extremely high thermal conductivity, low bleed and high temperature stability. Electrically insulating (4 x 10^13 ohm-cm).

Specifications
Viscosity: 87,000 cP (87,000 mPas)
Density: 2.5g/cc
Thermal Conductivity: 8.5 W/mK
Thermal Resistance: 0.03 C*cm2/W
Electrical Volume Resistivity: 4 x 10^13 ohm-cm
Operating Temperature (Continuous): -40 to 150C (-40 to 302F)
Operating Temperature (Peak): 200C (392F)
Operating Life: >8 years *dependent on several factors, test in application to ensure suitability
Size: 1g/1cc Syringe

Storage and Handling
Store refrigerated or at room temperature 3-25C (37-77F). Allow 4 hours for thermal paste to reach an application temperature of 20-25C (68-77F) before use.

Shelf Life
>24 months

Stencil Life
>7 days @ 20-70% RH 22-28C (72-82F)

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

Documents

Datasheet
MSDS Sheet
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