Lead-Free / RoHS 3 Compliant / REACH Compliant
CHIPQUIK® Ultra Max™ High Density Thermal Paste. Grey, non-curing, flowable, thermally conductive heat sink compound. Heavily filled with heat-conductive metal oxide. Provides extremely high thermal conductivity, low bleed and high temperature stability. Electrically insulating (4 x 10^13 ohm-cm).
Viscosity: 87,000 cP (87,000 mPas)
Thermal Conductivity: 8.5 W/mK
Thermal Resistance: 0.03 C*cm2/W
Electrical Volume Resistivity: 4 x 10^13 ohm-cm
Operating Temperature (Continuous): -40 to 150C (-40 to 302F)
Operating Temperature (Peak): 200C (392F)
Operating Life: >8 years *dependent on several factors, test in application to ensure suitability
Size: 1g/1cc Syringe
Storage and Handling
Store refrigerated or at room temperature 3-25C (37-77F). Allow 4 hours for thermal paste to reach an application temperature of 20-25C (68-77F) before use.
>7 days @ 20-70% RH 22-28C (72-82F)
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.