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Heat Sink Thermal Compound - High Density 200g Jar

[Part Number: TC1-200G]
In Stock
Click to enlarge

Lead-Free / RoHS 3 Compliant / REACH Compliant
High Density Thermal Paste. White, non-curing and non-flowing thermally conductive heat sink compound. Heavily filled with heat-conductive metal oxide. Provides high thermal conductivity, low bleed and high temperature stability. Electrically insulating (2 x 10^15 ohm-cm).

Viscosity: 542,000 cP (542,000 mPas)
Density: 2.1g/cc
Bleed: 0.23%
Thermal Conductivity: 0.67 W/mK
Thermal Resistance: 0.16 C*cm2/W
Electrical Volume Resistivity: 2 x 10^15 ohm-cm
Dielectric Strength: 8.27 MV/m (210V/mil)
Evaporation: 0.38%
Operating Temperature (Continuous): -40 to 150C (-40 to 302F)
Operating Temperature (Peak): 200C (392F)
Size: 200g Jar

Storage and Handling
Store refrigerated or at room temperature 3-25C (37-77F). Allow 4 hours for thermal paste to reach an application temperature of 20-25C (68-77F) before use.

Shelf Life
>60 months

This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.


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