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Lead-Free / RoHS 3 Compliant / REACH Compliant
Description
Heat curing epoxy chip bonding adhesive designed to bond surface mount chips and ICs to printed circuit boards (PCBs). Low Viscosity. Designed to be dot/line dispensed.
Allows large/heavy surface mount components to be permanently bonded to a PCB during reflow, allowing two sided surface mount reflow without larger chips/ICs coming loose.
Curing Time
120-180 seconds at 190+ Celsius (374+ F)
Recommended Curing Temperature: 190 to 260C (374 to 500F)
Maximum Curing Temperature: 260C (500F)
Designed to cure at leaded (Sn63/Pb37) and lead free (SAC305) reflow temperatures.
Maximum recommended dot size: 10mm x 10mm x 1mm (100mm^3)
Specifications (After Curing)
Operating Temperature Range: -40 to 125C (-40 to 257F) (After Curing, After Reflow)
Density: 1.4g/cc
Viscosity (Malcom @ 5 RPM, 25C): 44 Pa-s (44,000 mPa-s)
Size
5g/5cc syringe
Shelf Life
Refrigerated >24 months, unrefrigerated >24 months
Stencil Life
>12 hours @ 20-50% RH 22-28C (72-82F)
>8 hours @ 50-70% RH 22-28C (72-82F)
Cleaning
Clean using isopropyl alcohol (IPA).
Storage and Handling
Store at 3-25C (37-77F). Do not freeze. Allow 4 hours for thermoset chip glue to reach an operating temperature of 20-25C (68-77F) before use.
Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
Documents
Datasheet
MSDS Sheet
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