Chip Quik
  Top » Catalog » Adhesive/Sealant (46) » AD6-5S My Account  |  Cart Contents  |  Checkout   |    
Search

Categories
Adhesive/Sealant (46)
  Chip Glue (7)
  Construction (1)
  Fire Barrier (2)
  Paintable Silicone (5)
  Polyurethane (4)
  Self-Leveling Silicone (2)
  Silicone Adhesive (16)
  Silicone Grease (2)
  Super Glue (7)
Aluminum Solder Paste (5)
Batteries (7)
ChipQuik Alloy (10)
Cleaning Chemicals (6)
Conductive Paint (3)
CQ100Ge Alloy (5)
Flux - Liquid (29)
Flux - Paste (6)
Flux - Tacky Flux (30)
Flux Remover (21)
Metals (5)
Mini Pocket Packs (14)
Polyimide Tape (13)
Removal Alloy (17)
RMA Solder Paste (6)
Smooth Flow (45)
Solder Bar Cast (12)
Solder Bar Extruded (9)
Solder Paste 2 Part Mix (4)
Solder Paste Cartridge (15)
Solder Paste Jars (29)
Solder Paste No Fridge (15)
Solder Paste Syringes (28)
Solder Ribbon (2)
Solder Shot (12)
Solder Spheres (42)
Solder Wick (3)
Solder Wire (158)
Solder/Desolder Kits (4)
Stained Glass Flux (5)
Thermal Paste (14)
Thermally Stable 991 (12)
Tip Tinner/Cleaner (1)
Tools/Accessories (2278)
What's New? more
PLCC-84 to PGA-84 Pin 1 In SMT Adapter (50 mils / 1.27 mm pitch) Compact Series
PLCC-84 to PGA-84 Pin 1 In SMT Adapter (50 mils / 1.27 mm pitch) Compact Series
$15.99
Information
MSDS
Shipping & Returns
Privacy Notice
Conditions of Use
Contact Us
Legal

Thermoset Chip Glue - Dispense (Low) Viscosity (Red) - 5cc Syringe

[Part Number: AD6-5S]
$11.95
USD
In Stock
Quantity:
100
Click to enlarge

Lead-Free / RoHS 3 Compliant / REACH Compliant
Description
Heat curing epoxy adhesive designed to bond surface mount chips and ICs to printed circuit boards (PCBs). Low Viscosity. Designed to be dot/line dispensed.

Allows large/heavy surface mount components to be permanently bonded to a PCB during reflow, allowing two sided surface mount reflow without larger chips/ICs coming loose.

Curing Time
90 to 120 seconds at 150+ Celsius (302+ F)
Recommended Curing Temperature: 150 to 260C (302 to 500F)
Maximum Curing Temperature: 260C (500F)
Designed to cure at leaded and lead free reflow temperatures.

Specifications (After Curing)
Operating Temperature Range: -40 to 125C (-40 to 257F) (After Curing, After Reflow)
Lap Shear Strength: >15MPa (Steel-Steel, 25C(77F))

Size
5g/5cc syringe

Shelf Life
Refrigerated >6 months, unrefrigerated >6 months

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Cleaning
Clean using isopropyl alcohol (IPA).

Storage and Handling
Store at 3-25C (37-77F). Do not freeze. Allow 4 hours for thermoset chip glue to reach an operating temperature of 20-25C (68-77F) before use.

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

Documents

Datasheet
MSDS Sheet
Shopping Cart more
0 items
Shipping Estimate
Estimate for United States
US Mail$4.00
UPS Ground$10.00
Fedex Overnight$16.00

Copyright © 1994-2021 Concept to Life Solutions Inc. DBA Chip Quik®
Contact Us