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Lead-Free / RoHS 3 Compliant / REACH Compliant
Description
Heat curing epoxy adhesive designed to bond surface mount chips and ICs to printed circuit boards (PCBs).
Allows large/heavy surface mount components to be permanently bonded to a PCB during reflow, allowing two sided surface mount reflow without larger chips/ICs coming loose.
Curing Time
90 to 120 seconds at 150+ Celsius (302+ F)
Designed to cure at leaded and lead free reflow temperatures.
Size
30g / 30cc syringe
Shelf Life
Refrigerated >12 months, unrefrigerated >12 months
Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Cleaning
Clean using isopropyl alcohol (IPA).
Storage and Handling
Store at 3-25C (37-77F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
Documents
Datasheet
MSDS Sheet
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