Lead-Free / RoHS 3 Compliant / REACH Compliant
Heat curing epoxy adhesive designed to bond surface mount chips and ICs to printed circuit boards (PCBs). Higher Viscosity for Stencil Printing. Designed to be printed with stencil and squeegee.
Allows large/heavy surface mount components to be permanently bonded to a PCB during reflow, allowing two sided surface mount reflow without larger chips/ICs coming loose.
90 to 120 seconds at 150+ Celsius (302+ F)
Recommended Curing Temperature: 150 to 260C (302 to 500F)
Maximum Curing Temperature: 260C (500F)
Designed to cure at leaded and lead free reflow temperatures.
Specifications (After Curing)
Operating Temperature Range: -40 to 125C (-40 to 257F) (After Curing, After Reflow)
Lap Shear Strength: >15MPa (Steel-Steel, 25C(77F))
Viscosity (Malcom @ 5 RPM, 25C): 450,000 mPa-s
Glass Transition Temperature (Tg): 80C
Coefficient of Thermal Expansion (CTE) below Tg: 60x10^-6/K
Coefficient of Thermal Expansion (CTE) above Tg: 120x10^-6/K
Thermal Conductivity: 0.14 W/mK
Dielectric Strength: 25 KV/mm (at 25C)
Dielectric Constant: 3.2 (at 25C, 1MHz)
Dielectric Loss Angle Tangent: <0.02 (at 25C, 1MHz)
Adhesive Spot Diameter Growth During Curing: <10%
30g / 30cc syringe
Refrigerated >3 months, unrefrigerated >3 months
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Clean using isopropyl alcohol (IPA).
Storage and Handling
Store at 3-25C (37-77F). Do not freeze. Allow 4 hours for thermoset chip glue to reach an operating temperature of 20-25C (68-77F) before use.
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.