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Thermoset Chip Glue (Red) - 30cc syringe

[Part Number: AD1-30S]
In Stock
Click to enlarge

Heat curing epoxy adhesive designed to bond surface mount chips and ICs to printed circuit boards (PCBs).

Allows large/heavy surface mount components to be permanently bonded to a PCB during reflow, allowing two sided surface mount reflow without larger chips/ICs coming loose.

Curing Time:
- 90 to 120 seconds at 150+ Celsius
- Designed to cure at leaded and lead free reflow temperatures.

Size: 30g / 30cc syringe

Related Products
Manual Syringe Gun for 30cc syringe
Manual Syringe Gun for 30cc syringe
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