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Sn96.5/Ag3.0/Cu0.5 .031" Solder Wire 1oz Spool (Solid Core) SAC305 (Tin/Silver/Copper)
Sn96.5/Ag3.0/Cu0.5 .031" Solder Wire 1oz Spool (Solid Core) SAC305 (Tin/Silver/Copper)
$11.99
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Jet Printing Solder Paste Sn96.5/Ag3.0/Cu0.5 T5 Vacuum Mixed 10cc/35g Syringe

[Part Number: JET551SNL10T5]
$49.95
USD
In Stock
Quantity:
100
Click to enlarge

Lead-Free / RoHS 3 Compliant / REACH Compliant
Description
Chip Quik Jet Printing Solder Paste
Optimized for Jet Printing Applications (Vacuum Mixed)

Specifications
Alloy: Sn96.5/Ag3.0/Cu0.5
Flux Type: Synthetic No-Clean
Flux Classification: ROL0
Metal Content: 84% metal by weight, vacuum mixed.
Particle Size: T5 (15-25 microns)
Melting Point: 217-220C (423-428F)
Size: 10cc/35g Syringe

Shelf Life
Refrigerated >12 months, unrefrigerated >6 months

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Store at 3-25C (37-77F). Do not freeze. Refrigeration is not required, but will extend shelf life. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

Documents

Datasheet
MSDS Sheet
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