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What's New? more
Chip Removal Alloy (3 feet, 3.175mm THICK Diameter) for SMD/SMT (6-6.5" sticks)
Chip Removal Alloy (3 feet, 3.175mm THICK Diameter) for SMD/SMT (6-6.5" sticks)
$26.95
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Solder Paste Sn96.5/Ag3.0/Cu0.5 T4 88.5% Water-Washable No-Clean 500g Cartridge Thermally Stable

[Part Number: WS430SNL500T4C]
$79.89
USD
In Stock
Quantity:
100
Click to enlarge

Lead-Free / RoHS 3 Compliant / REACH Compliant
Description
Chip Quik WS430 Series Thermally Stable Solder Paste Water-Soluble Lead-Free SAC305 in 500g cartridge.
Revolutionary Formula: No Refrigeration Required!

Specifications
Alloy: Sn96.5/Ag3.0/Cu0.5
Flux Type: Synthetic Water-Washable No-Clean
Flux Classification: REL0 (Residue can be washed off with hot water (60C+), or left on (no-clean) for most applications)
Metal Content: 88.5% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 217C (423F)
Size: 500g cartridge

Shelf Life
Refrigerated >12 months, unrefrigerated >12 months

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Store at 3-25C (37-77F). Do not freeze. Refrigeration is not required, but will extend shelf life. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

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