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Description
Chip Quik WS430 Series Thermally Stable Solder Paste Water-Washable No-Clean Sn/Pb in 500g cartridge.
Revolutionary Formula: No Refrigeration Required!
Print Grade, Higher metal loading. For use with automated stencil printing machines.
Specifications
Alloy: Sn63/Pb37
Flux Type: Synthetic Water-Washable No-Clean
Flux Classification: REL0 (Residue can be washed off with hot water (60C+), or left on (no-clean) for most applications)
Metal Content: 89.75% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 183C (361F)
Size: 500g cartridge
Shelf Life
Refrigerated >12 months, unrefrigerated >12 months
Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Store at 3-25C (37-77F). Do not freeze. Refrigeration is not required, but will extend shelf life. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
 WARNING! This product can expose you to Lead, which is known to the State of California to cause Cancer, Birth Defects, or other Reproductive Harm. For more information, go to: www.P65Warnings.ca.gov
Documents
Datasheet
MSDS Sheet
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