Chip Quik
  Top » Catalog » Thermally Stable 991 (16) » WS991LT35T4 My Account  |  Cart Contents  |  Checkout   |    
Search

Categories
Adhesive/Sealant (36)
Aerosols (5)
Aluminum Solder Paste (5)
ChipQuik Alloy (10)
Cleaning Chemicals (8)
Conductive Paint (3)
CQ100Ge Alloy (6)
Dielectric Silicone Grease (5)
ESD Foam (8)
ESD Mats & Parts (10)
Flux - Liquid (38)
Flux - Paste (7)
Flux - Tacky Flux (37)
Flux Remover (23)
Gold Wire/Paste (4)
IPA Stencil Wipes (4)
IPC Testing Flux (8)
Jet Printing Solder Paste (6)
Liquid Nano Coating (9)
Metals (14)
Mini Pocket Packs (14)
Nickel Solder Paste (8)
Polyimide Tape (13)
Removal Alloy (17)
RMA Solder Paste (13)
Servo Motors (2)
Smooth Flow (45)
Sockets (7)
Solder Bar Cast (15)
Solder Bar Extruded (12)
Solder Paste 2 Part Mix (6)
Solder Paste Cartridge (15)
Solder Paste Jars (35)
Solder Paste No Fridge (15)
Solder Paste Syringes (39)
Solder Ribbon (3)
Solder Shot (12)
Solder Spheres (56)
Solder Wick (4)
Solder Wire (175)
Solder/De-Solder Tools (1)
Solder/Desolder Kits (4)
Stained Glass Flux (5)
Thermal Paste (14)
Thermally Stable 991 (16)
  Lead-Free (11)
  Leaded (5)
Tip Tinner/Cleaner (1)
Tools/Accessories (2604)
What's New? more
Liquid Nano Coating -  2% Polymer 30ml (44g) in 1oz Glass Jar
Liquid Nano Coating - 2% Polymer 30ml (44g) in 1oz Glass Jar
$19.95
Information
MSDS
ISO Certificate
Shipping & Returns
Privacy Notice
Conditions of Use
Contact Us
Terms & Conditions

Thermally Stable Solder Paste WS (Water-Soluble) Sn42/Bi57.6/Ag0.4 T4 (35g syringe)

[Part Number: WS991LT35T4]
$26.95
USD
In Stock
Quantity:
100
Click to enlarge

Lead-Free / RoHS 3 Compliant / REACH Compliant
Description
Chip Quik 991 Series Thermally Stable Solder Paste Water-Soluble (T4) Sn42/Bi57.6/Ag0.4 Low Temperature 90% metal melts @ 138C, 281F Water-Soluble in 35g/10cc syringe with plunger and tips.
Revolutionary Formula: No Refrigeration Required!

Specifications
Alloy: Sn42/Bi57.6/Ag0.4
Flux Type: Synthetic Water-Soluble
Flux Classification: REM0 (Residue must be water-washed at 60C+ after reflow)
Metal Content: 87% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 138C (281F)
Size: 35g/10cc syringe

Shelf Life
Refrigerated >6 months, unrefrigerated >6 months

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Store at 3-25C (37-77F). Do not freeze. Refrigeration is not required, but will extend shelf life. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

Documents

Datasheet
MSDS Sheet
Shopping Cart more
0 items
Shipping Estimate
Estimate for United States
US Mail$4.00
UPS Ground$10.00
Fedex Overnight$16.00

Copyright © 1994-2024 Concept to Life Solutions Inc. DBA Chip Quik®
Contact Us