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Metal Chelating Wipes (IPA/Water/Chelating Agent Lint-Free) - 100 count, 9"x6.1" each
Metal Chelating Wipes (IPA/Water/Chelating Agent Lint-Free) - 100 count, 9"x6.1" each
$13.95
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Thermally Stable Solder Paste WS (Water-Soluble) Sn63/Pb37 T4 (35g syringe)

[Part Number: WS991AX35T4]
$24.95
USD
In Stock
Quantity:
100
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Description
Chip Quik 991 Series Thermally Stable Solder Paste Water-Soluble Sn/Pb in 35g/10cc syringe with plunger and tips.
Revolutionary Formula: No Refrigeration Required!

Specifications
Alloy: Sn63/Pb37
Flux Type: Synthetic Water-Soluble
Flux Classification: REM0 (Residue must be water-washed at 60C+ after reflow)
Metal Content: 87% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 183C (361F)
Size: 35g/10cc syringe

Shelf Life
Refrigerated >6 months, unrefrigerated >6 months

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Store at 3-25C (37-77F). Do not freeze. Refrigeration is not required, but will extend shelf life. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

WARNING! This product can expose you to Lead, which is known to the State of California to cause Cancer, Birth Defects, or other Reproductive Harm. For more information, go to: www.P65Warnings.ca.gov

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