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What's New? more
Solder Wire 63/37 Tin/Lead (Sn63/Pb37) No-Clean .015 1lb
Solder Wire 63/37 Tin/Lead (Sn63/Pb37) No-Clean .015 1lb
$42.47
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Thermally Stable Solder Paste NC (No-Clean) Sn63/Pb37 T4 (35g syringe)

[Part Number: TS991AX35T4]
$24.95
USD
In Stock
Quantity:
100
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Description
Chip Quik 991 Series Thermally Stable Solder Paste No-Clean Sn/Pb in 35g/10cc syringe with plunger and tips.
Revolutionary Formula: No Refrigeration Required!

Specifications
Alloy: Sn63/Pb37
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Content: 88% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 183C (361F)
Size: 35g/10cc syringe

Shelf Life
Refrigerated >12 months, unrefrigerated >12 months

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Store at 3-25C (37-77F). Do not freeze. Refrigeration is not required, but will extend shelf life. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

WARNING! This product can expose you to Lead, which is known to the State of California to cause Cancer, Birth Defects, or other Reproductive Harm. For more information, go to: www.P65Warnings.ca.gov

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