Lead-Free / RoHS 3 Compliant / REACH Compliant
Chip Quik 991 Series Thermally Stable Solder Paste Water-Soluble (T4) Sn42/Bi57.6/Ag0.4 Low Temperature 90% metal melts @ 138C, 281F Water-Soluble in 500g jar.
Revolutionary Formula: No Refrigeration Required!
Flux Type: Synthetic Water-Soluble
Flux Classification: REM0 (Residue must be water-washed at 60C+ after reflow)
Metal Content: 90% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 138C (281F)
Size: 500g jar
Refrigerated >6 months, unrefrigerated >6 months
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Store at 3-25C (37-77F). Do not freeze. Refrigeration is not required, but will extend shelf life. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.