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Plunger and Retainer for 10cc syringe - qty 1
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Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (500g jar)

[Part Number: TS991SNL500T4]
$79.95
USD
In Stock
Quantity:
100
Click to enlarge

Lead-Free / RoHS 3 Compliant / REACH Compliant
Description
Chip Quik 991 Series Thermally Stable Solder Paste No-Clean Lead-Free SAC305 in 500g jar.
Revolutionary Formula: No Refrigeration Required!

Alloy: Sn96.5/Ag3.0/Cu0.5
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Content: 88.5% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 217C (423F)
Size: 500g jar

Shelf Life
Refrigerated >12 months, unrefrigerated >12 months

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Store at 3-25C (37-77F). Do not freeze. Refrigeration is not required, but will extend shelf life. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

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