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Lead-Free / RoHS 3 Compliant / REACH Compliant
Description
Low Temperature RMA Solder Paste (ROL0)
Ultra Low Balling Formula
Specifications
Alloy: Sn42/Bi57.6/Ag0.4
Flux Type: Synthetic RMA (for Lead-Free applications)
Flux Classification: ROL0
Metal Content: 90% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 138C (281F)
Size: 250g jar
Shelf Life
Refrigerated >6 months, unrefrigerated >2 months
Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
Documents
Datasheet
MSDS Sheet
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