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RMA Solder Paste Sn42/Bi57.6/Ag0.4 Ultra Low Balling T4 (35g syringe) ROL0

[Part Number: RMA591L0LT10]
$28.95
USD
In Stock
Quantity:
100
Click to enlarge

Lead-Free / RoHS 3 Compliant / REACH Compliant
Description
Low Temperature RMA Solder Paste (ROL0)
Ultra Low Balling Formula

Specifications
Alloy: Sn42/Bi57.6/Ag0.4
Flux Type: Synthetic RMA (for Lead-Free applications)
Flux Classification: ROL0
Metal Content: 87% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 138C (281F)
Size: 10cc/35g syringe

Shelf Life
Refrigerated >6 months, unrefrigerated >2 months

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

Documents

Datasheet
MSDS Sheet
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