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Aluminum Solder Paste Water-Soluble Sn96.5/Ag3.5 T3 (50g jar)

[Part Number: SMDAL50]
$25.95
USD
In Stock
Quantity:
100
Click to enlarge

Lead-Free / RoHS 3 Compliant / REACH Compliant
Description
Chip Quik Aluminum Soldering Paste Water-Soluble Lead-Free in 50g jar.
Use to solder Aluminum Heat Sinks to printed circuit boards. For soldering Aluminum to Aluminum, Copper, and Nickel Coated Aluminum.

Specifications
Alloy: Sn96.5/Ag3.5
Flux Type: Synthetic Water-Soluble
Flux Classification: ROM1 (Water Soluble, Must be cleaned off post-use using Hot Water (60C+) or IPA)
Metal Content: 75% metal by weight.
Particle Size: T3 (25-45 microns)
Melting Point: 221C (430F)
Size: 50g jar

Shelf Life
Refrigerated >12 months, unrefrigerated >6 months

Stencil Life
>12 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

Documents

Datasheet
MSDS Sheet
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