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Lead-Free / RoHS 3 Compliant / REACH Compliant
Description
Chip Quik Aluminum Soldering Paste Water-Soluble Lead-Free in 400g cartridge.
Use to solder Aluminum Heat Sinks to printed circuit boards. For soldering Aluminum to Aluminum, Copper, and Nickel Coated Aluminum.
Specifications
Alloy: Sn96.5/Ag3.5
Flux Type: Synthetic Water-Soluble
Flux Classification: ROM1 (Water Soluble, Must be cleaned off post-use using Hot Water (60C+) or IPA)
Metal Content: 75% metal by weight.
Particle Size: T3 (25-45 microns)
Melting Point: 221C (430F)
Size: 6oz/400g cartridge
Shelf Life
Refrigerated >12 months, unrefrigerated >6 months
Stencil Life
>12 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
Documents
Datasheet
MSDS Sheet
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