Lead-Free / RoHS Compliant
Chip Quik Aluminum Soldering Paste Water-Soluble Lead-Free in 200g jar.
Use to solder Aluminum Heat Sinks to printed circuit boards. For soldering Aluminum to Aluminum, Copper, and Nickel Coated Aluminum.
Flux Type: Water-Soluble
Flux Classification: ROM1 (Water Soluble, Must be cleaned off post-use using Water or IPA)
Metal Content: 75% metal by weight.
Particle Size: T3 (25-45 microns)
Melting Point: 221C (430F)
Size: 200g jar
Refrigerated >18 months, unrefrigerated >12 months
>12 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.