Lead-Free / RoHS 3 Compliant / REACH Compliant
Chip Quik Aluminum Soldering Paste Water-Soluble Lead-Free in 200g jar.
Use to solder Aluminum Heat Sinks to printed circuit boards. For soldering Aluminum to Aluminum, Copper, and Nickel Coated Aluminum.
Flux Type: Synthetic Water-Soluble
Flux Classification: ROM1 (Water Soluble, Must be cleaned off post-use using Hot Water (60C+) or IPA)
Metal Content: 75% metal by weight.
Particle Size: T3 (25-45 microns)
Melting Point: 221C (430F)
Size: 200g jar
SMDAL uses a special stronger flux to break down the aluminum oxide layer when it is heated (activated). You need to apply sufficient heat in a short enough amount of time to activate the flux in the solder paste, and then heat your aluminum to 260-300 Celsius, and do that within 4-5 minutes. The solder paste itself needs to reach at least 249C (as per our recommended reflow profile) to fully melt, but you will usually need to heat your aluminum hotter than this. Also, make sure to measure the temperature of the aluminum, and not the surrounding air. Heating the aluminum to 260-300 Celsius, or even a little hotter will help the aluminum accept the solder and form a strong intermetallic bond with the Tin/Silver alloy in the SMDAL solder paste.
The biggest factor in success in soldering to aluminum with the SMDAL is getting enough heat into the aluminum in a short amount of time, before all the flux activity in the SMDAL is used up.
Refrigerated >12 months, unrefrigerated >6 months
>12 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.