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Thermally Stable Solder Paste No-Clean Sn63/Pb37 T4 (250g jar)

[Part Number: TS391AX250]
$54.95
USD
In Stock
Quantity:
100
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Description
Chip Quik TS [Thermally Stable] Solder Paste No-Clean Sn/Pb in 250g jar.
Revolutionary Formula: No Refrigeration Required!

Specifications
Alloy: Sn63/Pb37
Flux Type: Synthetic No-Clean
Flux Classification: ROL0
Metal Content: 90.25% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 183C (361F)
Size: 250g jar

Shelf Life
Refrigerated >12 months, unrefrigerated >12 months

Stencil Life
>12 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Store at room temperature 20-25C (68-77F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25C (68-77F), therefore no warming time is required before use.

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

WARNING! This product can expose you to Lead, which is known to the State of California to cause Cancer, Birth Defects, or other Reproductive Harm. For more information, go to: www.P65Warnings.ca.gov

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