Lead-Free / RoHS 3 Compliant / REACH Compliant
Water-Soluble Solder Paste for Nickel and Copper Soldering. Low Temperature Alloy. Higher Activity, Better Wetting. Designed for Hard to Solder Surfaces including Nickel, Nickel Plated Copper and Copper.
Flux Type: Synthetic Water-Soluble
Flux Classification: REH1 (Must be cleaned off post-use using Hot Water (60C+), Flux Remover or IPA)
Flux Activation Temperature: 140C (284F)
Metal Content: 88.5% metal by weight.
Particle Size: T3 (25-45 microns)
Melting Point: 138C (281F)
Size: 250g Two Part Mix
Before Mixed: Refrigerated >24 months, unrefrigerated >24 months
After Mixed: Refrigerated <1 day, unrefrigerated <1 day. This solder paste is high activity, it is designed to be used after mixing. Once mixed, the high activity does not allow shelf storage.
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Before Mixed: Store refrigerated or at room temperature 3-25C (37-77F). Do not freeze.
After Mixed: Use same day as mixed. This solder paste is high activity, it is designed to be used after mixing. Once mixed, the high activity does not allow shelf storage.
Once mixed, the solder paste can be dispensed by cutting a small corner off the bag. It can be resealed with a piece of tape, or it can be stored by dispensing the entire bag into the provided empty jar.
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
How to Use Our Two Part Mix Kits: