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Lead-Free / RoHS 3 Compliant / REACH Compliant
Description
67% Metal Load Solder Paste Lead-Free Sn42/Bi57.6/Ag0.4 Low Temperature T5 mesh 10cc Syringe. Co-Flux Formula: 11% SMDLT flux and 22% SMD291 flux.
Specifications
Alloy: Sn42/Bi57.6/Ag0.4
Flux Type: Synthetic No-Clean (Co-Flux: 11% SMDLT, 22% SMD291)
Flux Classification: REL0
Metal Content: Custom 67% metal by weight.
Particle Size: T5 (15-25 microns)
Melting Point: 138C (281F)
Size: 10cc/20g syringe
Shelf Life
Refrigerated >6 months, unrefrigerated >2 months
Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
Documents
Datasheet
MSDS Sheet
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