BGA-100 (0.4 mm ball pitch, 10 x 10 pin array) stainless steel solder paste stencil.
Stencil Dimensions: 1.35" x 1.95" x 0.004"
This stencil has been designed to work with the following PCB footprint:
Footprint Datasheet: BGA0023 (pdf)
Application Note: AN0001: Circuit Assembly Instructions using Proto Advantage PCBs and Stencils (pdf)
Please note: If the stencil footprint has a center thermal pad (shown as a single pad in the PCB and Stencil datasheets), the stencil may contain several smaller apertures (windows) that together align solder paste over the single center pad on the PCB.