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Solder Paste in jar 250g (T6) SAC305 (Sn96.5/Ag3.0/Cu0.5) No-Clean
Solder Paste in jar 250g (T6) SAC305 (Sn96.5/Ag3.0/Cu0.5) No-Clean
$219.00
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Compact Series Adapter Top Side IC Stencil and Secondary Reflow Spacer

[Part Number: COMP-TOP-STENCIL-HELP-1]
$19.95
USD
In Stock
Quantity:
100
Click to enlarge

100
Click to enlarge

100
Click to enlarge

Description:
Custom thickness assembly spacer to hold compact adapter bottom pins so that the top side IC footprint can be stenciled using our stainless steel solder paste stencils. Also holds the bottom side pins in place for secondary reflow after top side IC is placed onto stenciled solder paste.

Designed to handle multiple lead-free (260C) reflow cycles.

Reusable. Suitable for 100+ reflow cycles.

NOTES: Plug compact adapter pins into the smaller holes. The larger holes are there to allow sufficient airflow during reflow to ensure even PCB heating.

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